Low pressure plasmas have found numerous applications in material processing and manufacturing semiconductor industries. The advantages of these plasmas are well known as they produce high density of reactive species advantageous for fast etch/deposition rates while maintaining the gas at near room temperature. This enables the surface treatment of thermally sensitive materials. On the other hand, operating plasma at low pressure has several downsides; vacuum systems are expensive and they require frequent maintenance. The size of the vacuum chamber also restricts the size of the object to be treated.
Atmospheric pressure plasmas overcome these vacuum requirements of low pressure plasmas, however generating plasma at atmospheric pressure (760 Torr) can have its own challenges. These plasmas have high reactivity due to the formation of multiple excited and ionized species and as such have an important role in many current and emerging fields, including plasma medicine, agriculture, plasma processing of materials and surfaces, catalysis, and aerospace engineering. Recent advancements in this area have emerged in the development of Plasma Jet and Dielectric Barrier Discharges.
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