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Navigating the Angstrom Age – Crafting Precision in Semiconductor Manufacturing

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HiPIMS induced high-purity Ti3AlC2 MAX phase coating at low-temperature of 700 ◦C

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Plasma Characteristics of a Novel Coaxial Laser-Plasma Hybrid Welding of Ti Alloy

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Asynchronously Pulsed Plasma for High Aspect Ratio Nanoscale Si Trench Etch Process

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Application Notes Applications Fundamental Research Octiv Mono 2.0 Octiv Poly 2.0 Octiv Suite 2.0 Process Performance

Plasma Atomic Layer Etching of SiO2 and Si3N4 with Low Global Warming C4H3F7O Isomers